Recombination is a process in which two oppositely charged particles combine to form a neutral particle. It is not a type of plasma-material interaction.

Sputtering is the process by which atoms are removed from a solid surface by the impact of energetic particles.

Deposition is the process by which material is deposited on a surface from a plasma.

Etching is the process by which material is removed from a surface by a chemical reaction with a plasma.

Erosion is the process by which material is removed from a surface by the impact of solid particles.

The sheath is the region of a plasma that is in contact with a material surface.

The thickness of the sheath is the Debye length.

The potential drop across the sheath is called the sheath potential.

The sheath potential accelerates ions towards the surface.

The sheath potential causes sputtering.

The main factor that determines the rate of sputtering is the ion energy.

The main factor that determines the rate of deposition is the ion flux.

The main factor that determines the rate of etching is the material surface temperature.

The main factor that determines the rate of erosion is the angle of incidence of the ions.

Plasma-material interactions have a wide range of applications, including thin film deposition, etching, sputtering, and surface modification.