Test 1 - Electronic Devices | Electronics and Communication (ECE)

Description: Topic wise test for Electronic Devices of Electronics and Communication (ECE)
Number of Questions: 20
Created by:
Tags: Electronic Devices Number Systems Properties of Numbers
Attempted 0/20 Correct 0 Score 0

A silicon PN junction is forward biased with a constant current at room temperature. When the temperature is increased by 10oC, the forward bias voltage across the PN junction

  1. increases by 60mV

  2. decreases by 60mV

  3. increases by 25mV

  4. decreases by 25mV


Correct Option: D
Explanation:

For every $1^\circ C$ increase in temperature, forward bias voltage across diode decreases by $2.5 mV$. Thus for $10^\circ C$ increase, there us $25mV$ decreases.

The i-v characteristics of the diode in the circuit given below are I = $\begin{cases} \dfrac{v - 0.7}{500} A, \end{cases}$ v $\ge$ 0.7V 0 A, v < 0.7 V The current in the circuit is

  1. 10 mA

  2. 9.3 mA

  3. 6.67 mA

  4. 6.2 mA


Correct Option: D
Explanation:

null

In a p+n junction diode under reverse bias, the magnitude of electric field is maximum at

  1. the edge of the depletion region on the p-side

  2. the edge of the depletion region on the n-side

  3. the p+n junction

  4. the centre of the depletion region on the n-side


Correct Option: C
Explanation:

The electric field has the maximum value at the junction of $p^+ n$.

The concentration of minority carriers in an extrinsic semiconductor under equilibrium is

  1. directly proportional to the doping concentration

  2. inversely proportional to the doping concentration

  3. directly proportional to the intrinsic concentration

  4. inversely proportional to the intrinsic concentration


Correct Option: B
Explanation:

The bandgap of silicon at 300 K is

  1. 1.36 eV

  2. 1.10 eV

  3. 0.80 eV

  4. 0.67 eV


Correct Option: B
Explanation:

In the three dimensional view of a silicon n - channel MOS transistor shown below, $\delta$= 20 nm. The transistor is of width 1 $\mu$m. The depletion width formed at every p - n junction is 10 nm. The relative permittivities of Si and SiO2, respectively, are 11.7 and 3.9, and $\epsilon_0$= 8.9 x 10-12 F/m. The gate-source overlap capacitance is approximately

  1. 0.7 fF

  2. 0.7 pF

  3. 0.35 fF

  4. 0.24 pF


Correct Option: A
Explanation:

null

Consider the following assertions:

S1 : For Zener effect to occur, a very abrupt junction is required. S2 : For quantum tunneling to occur, a very narrow energy barrier is required.

Which of the above assertions is/are correct?

  1. Only S2 is true.

  2. S1 and S2 are both true, but S2 is not a reason for S1.

  3. Only S1 is true.

  4. Both S1 and S2 are false.


Correct Option: A
Explanation:

 Options (1) is correct.

In the three dimensional view of a silicon n - channel MOS transistor shown below, $\delta$= 20 nm. The transistor is of width 1 $\mu$m. The depletion width formed at every p - n junction is 10 nm. The relative permittivities of Si and SiO2, respectively, are 11.7 and 3.9, and $\epsilon_0$= 8.9 x 10-12 F/m. The source - body junction capacitance is approximately

  1. 2 fF

  2. 7 fF

  3. 2 pF

  4. 7 pF


Correct Option: A
Explanation:

null

A heavily doped n − type semiconductor has the following data: Hole-electron mobility ratio: 0.4 Doping concentration: 84.2 ×10 atoms/m3 Intrinsic concentration: 41.5 ×10 atoms/m3 The ratio of conductance of the n − type semiconductor to that of the intrinsic semiconductor of same material and at the same temperature is given by

  1. 0.00005

  2. 2,000

  3. 10,000

  4. 20,000


Correct Option: D
Explanation:

A Zener diode used in voltage stabilisation circuits is biased in

  1. reverse bias region below the breakdown voltage

  2. reverse breakdown region

  3. forward bias region

  4. forward bias constant current mode


Correct Option: B
Explanation:

A particular green LED emits light of wavelength 5490°A. The energy bandgap of the semiconductor material used there is (Planck's constant = 6.626$\times$10-34J -s)

  1. 2.26 eV

  2. 1.98 eV

  3. 1.17 eV

  4. 0.74 eV


Correct Option: A
Explanation:

For an n-channel MOSFET and its transfer curve shown in figure, the threshold voltage is

  1. 1 V and the device is in active region

    • 1 V and the device is in saturation region
  2. 1 V and the device is in saturation region

    • 1 V and the device is in active region

Correct Option: C
Explanation:

Thick oxide in a CMOS process is preferably grown using

  1. wet oxidation

  2. dry oxidation

  3. epitaxial deposition

  4. ion implantation


Correct Option: B
Explanation:

Dry oxidation is used to achieve high quality oxide growth.

Which of the following options is true?

  1. A silicon wafer heavily doped with boron is a p+ substrate.

  2. A silicon wafer lightly doped with boron is a p+ substrate.

  3. A silicon wafer heavily doped with arsenic is a p+ substrate.

  4. A silicon wafer lightly doped with arsenic is a p+ substrate.


Correct Option: A
Explanation:

Trivalent impurities are used for making p- type semiconductors. So, Silicon wafer heavily doped with boron is a p+ substrate.

Group I lists four types of p-n junction diodes. Match each device in Group I with one of the option in Group II to indicate the bias condition of that device in its normal mode of operation.||| |---|---| | Group I| Group II| | (P) Zener Diode| (1) Forward bias| | (Q) Solar cell| (2) Reverse bias| | (R) LASER diode| | | (S) Avalanche Photodiode| |

  1. P-1, Q-2, R-1, S-2

  2. P-2, Q-1, R-1, S-2

  3. P-2, Q-2, R-1, S-1

  4. P-2, Q-1, R-2, S-2


Correct Option: B
Explanation:

Consider the following statements S1 and S2. S1 : The $\beta$ of a bipolar transistor reduces if the base width is increased. S2 : The $\beta$ of a bipolar transistor increases if the doping concentration in the base is increased.

Which of the following statements is correct?

  1. S1 is FALSE and S2 is TRUE

  2. Both S1 and S2 are TRUE

  3. Both S1 and S2 are FALSE

  4. S1 is TRUE and S2 is FALSE


Correct Option: D
Explanation:

In an abrupt p – n junction, the doping concentrations on the p − side and n − side are ND = 1016/cm3 and NA = 9 x 1016/cm3 respectively. The p – n junction is reverse biased and the total depletion width is 3 $\mu$m. The depletion width on the p −side is

  1. 2.7 $\mu$m

  2. 0.3 $\mu$m

  3. 2.25 $\mu$m

  4. 0.75 $\mu$m


Correct Option: B
Explanation:

In an n-type silicon crystal at room temperature, which of the following can have a concentration of 4 x1019 cm-3?

  1. Silicon atoms

  2. Holes

  3. Dopant atoms

  4. Valence electrons


Correct Option: C
Explanation:

Only dopant atoms can have concentration of 4 x 1019 cm -3 in n −type silicon at room temperature.

Consider the following two statements about the internal conditions in a n − channel MOSFET operating in the active region. S1 : The inversion charge decreases from source to drain. S2 : The channel potential increases from source to drain. Which of the following is correct?

  1. Only S2 is true.

  2. Both S1 and S2 are false.

  3. Both S1 and S2 are true, but S2 is not a reason for S1.

  4. Both S1 and S2 are true, and S2 is a reason for S1.


Correct Option: D
Explanation:

Both S1 and S2 are true and S2 is a reason for S1.

Compared to a p-n junction with NA=ND=1014/cm3, which one of the following statements is TRUE for a p-n junction with NA=ND=1020/cm3?

  1. Reverse breakdown voltage is lower and depletion capacitance is lower.

  2. Reverse breakdown voltage is higher and depletion capacitance is lower.

  3. Reverse breakdown voltage is lower and depletion capacitance is higher.

  4. Reverse breakdown voltage is higher and depletion capacitance is higher.


Correct Option: C
Explanation:

Reverse bias breakdown or Zener effect oauts in highly doped PN junction through tunneling mechanism. In a highly doped PN Junction, the conduction and valence beads on opposite tides of the junction are sufficiently doe. dogleg raven. bias that electron may tunnel directly from the valence hand on the p-side into the conduction bend on n-side.

Breakdown voltage $V_B \propto \dfrac{1}{N_AN_D}$

So, breakdown voltage decreases as concentration increases

Depletion capacitance $C = \left[ \dfrac{\epsilon_0 N_AN_D}{2(V_{be} + V_R) (N_A + N_D) } \right]^{8/x} $

Thus $C \propto N_AN_D$

Depletion capacitance increases as concentration increases

- Hide questions